GaN-based mid-power flip-chip light-emitting diode with high −3 dB bandwidth for visible light communications
Submount for high power LED 1-Submount for high power LED-Huabo(Suzhou) Thinfilm Technology Co.,ltd.
Photograph of the flip-chip (FC) LED mounted on a Si submount with an... | Download Scientific Diagram
Schematic of a deep UV LED heterostructure flip-chip mounted onto a... | Download Scientific Diagram
OSA | A novel integrated structure of thin film GaN LED with ultra-low thermal resistance
Research status and prospects of deep ultraviolet devices
Custom Packaging Solutions | Metallized Substrates, Packages & Components
AN033_Processing of LEDs - Information on the multi-chip ceramic OSLON Submount CL LEDs.fm
Examine the heated question of chip-scale packaging in the LED industry (MAGAZINE) | LEDs Magazine
Through-Silicon via Submount for Flip-Chip LEDs
Ceramic Packages for Light Emitting Diodes (LEDs) | Ceramic Packages | Products | KYOCERA
OSLON® Submount CL, KW C3L5L1.TE | OSRAM Opto Semiconductors
Techniques for Thermal Management in LED Lighting
Laser & Photo Diode Submounts | Thick & Thin Metallization | Plated Copper
nanoplus | Mid-Infrared LEDs: 4000 nm - 5300 nm
LED Substrates and Submounts | Cost Effective Ceramic Packaging
Submounts and Subcarriers | Components for Fiber-Optic Communication Modules | Ceramic Packages | Products | KYOCERA
What Does LED Stands for?
Lumileds talks LED packaging - interview
Analysis of electrical parameters of InGaN-based LED packages with aging - ScienceDirect
LED Submount - Remtec
LED Die Bonding | SpringerLink
led-substrates-and-submounts - Remtec
About LED - Reno LED Lighting
